Data Center Liquid Cooling
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JETCOOL's liquid cooling modules handle the market’s highest power density devices and are easily integrable to any board and chip size. Our patented cooling technology attaches directly to the device, eliminating thermal pastes and interface materials, minimizing thermal resistance. Small fluid jets within compact cooling modules transform cooling performance at the chip or device-level. Coolant efficiently removes heat from the "processor lid" as small cooling jets directly contact the device. Our solutions are compatible with most "CDU" or "facility liquid cooling infrastructure".
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